| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flattening device capable of flattening the head part of solder bumps stably to a substantially uniform height, by performing parallelism adjustment of the mounting surface of a table on which a wiring board having solder bumps formed on the upper surface is mounted, and the press surface of a press head for pressing and flattening the head part of solder bumps easily and accurately. <P>SOLUTION: A flattening device 10 of solder bump B for pressing and flattening the head part of solder bumps B formed on the upper surface of a wiring board C includes a table 1 having a flat mounting surface 2a on the upper side of which the wiring board C is mounted, and a press head 4 having a flat press surface 4a on the lower side and pressing the head part by the press surface 4a. The table 1 has a tilting mechanism which makes the mounting surface 2a tiltable within a predetermined inclination range as the press head 4 presses the head part, and fixing means for fixing the inclination operation of the tilting mechanism. <P>COPYRIGHT: (C)2013,JPO&INPIT |
