IMAGE SENSOR CHIP AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a metal shield layer of a rear surface radiation type image sensor chip and a manufacturing method of the image sensor chip.

SOLUTION: An image sensor chip includes: a semiconductor substrate 26 having a front surface and a rear surface; a first photosensitive device 24B which is disposed on the surface of the semiconductor substrate 26, is formed so as to receive an optical signal 62 from the rear surface side of the semiconductor substrate 26, and coverts the optical signal 62 into an electronic signal; an amorphous adhesive layer 50 disposed on the rear surface side of the semiconductor substrate 26 and containing a compound of nitrogen and metal; and a metal shield layer 52 disposed on the rear surface side of the semiconductor substrate and contacting with the amorphous adhesive layer 50.

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