| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin mold frame and an optical semiconductor device, which are excellent in adhesion between a lead frame and a resin and which do not cause resin leakage. <P>SOLUTION: A resin mold frame of an embodiment includes a groove in a lead frame on which a mold resin is molded. Accordingly, a bonding strength between the lead frame and the mold resin can be strong. Further, because an optical semiconductor device uses the resin mold frame, leakage of a phosphor resin from a boundary between the lead frame and the mold resin can be prevented even when the phosphor resin is filled. <P>COPYRIGHT: (C)2013,JPO&INPIT |
