| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power conversion apparatus that allows further downsizing. <P>SOLUTION: A power conversion apparatus 1 includes a stack 10 in which a plurality of semiconductor modules 2 and a plurality of coolant passages 11 are stacked. The stack 10 is housed in a frame 5. A plurality of bus bars 3 (3a to 3c) are connected to power terminals 21 of the semiconductor modules 2. Each of bus bars 3 has a connection portion 4 for connecting to another electronic component. A pressure member 6 is disposed in a gap G between a plane P including an inner surface 58 of the frame 5 and the stack 10. The pressure member 6 compresses the stack 10 to the stacking direction (X direction) and fixes the stack 10 to the frame 5. A part of the connection portions 4 of the plurality of connection portions 4 are located in the gap G as viewed from the projection direction (Z direction) of the power terminals 21. <P>COPYRIGHT: (C)2013,JPO&INPIT |
