PACKAGE-ON-PACKAGE (POP) STRUCTURE AND METHOD

摘要

PURPOSE: A package on package structure and a method thereof are provided to increase the density of the connectors by vertically connecting an array of ball grid packages. CONSTITUTION: A stud bulb is combined with the first surface of a first substrate(90). A die is adhered to the first surface. An electrical connector(96) is combined with a second substrate(102). The electrical connector is combined with the stud bulb. The first substrate includes pads.