| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method which can mount electrodes of a semiconductor element on solder bumps in stable condition and electrically connect the electrodes of the semiconductor element and semiconductor element connection pads successfully. <P>SOLUTION: A wiring board manufacturing method comprises: a step of forming semiconductor element connection pads and a solder resist layer 5b on an insulation substrate; a step of welding solder bumps B1 higher than a top face of the solder resist layer 5b on the semiconductor element connection pads; and a step of planarizing tops of the solder bumps B1 to become lower than the top face of the solder resist layer 5b by rolling a pressure roller R on the solder resist layer 5b and the solder bumps B1 so as to dent the solder resist layer 5b by elastic deformation and crash the solder bumps B1 by plastic deformation. <P>COPYRIGHT: (C)2013,JPO&INPIT |
