| 发明名称 |
SUBSTRATE FOR ELEMENT CONNECTION, METHOD FOR MANUFACTURING THE SAME, AND LIGHT-EMITTING DIODE DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for element connection which has excellent light reflectivity while allowing a sealing sheet to reliably seal a light-emitting diode element to be connected, and to provide a method for manufacturing the same and a light-emitting diode device having excellent luminous efficiency. <P>SOLUTION: A substrate 1 for element connection comprises: a lead frame 4 onto which a light-emitting diode element 17 is connected and which is provided with a plurality of leads 3 arranged with gaps 2 therebetween; and light-reflective first insulating resin parts 5 filling the gaps 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013115310(A) |
申请公布日期 |
2013.06.10 |
| 申请号 |
JP20110261702 |
申请日期 |
2011.11.30 |
| 申请人 |
NITTO DENKO CORP |
发明人 |
OYABU KYOYA;FUKUYA KAZUHIRO;TSUKAHARA DAISUKE;KONDO TAKASHI |
| 分类号 |
H01L33/48 |
主分类号 |
H01L33/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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