CREATION OF COMBINATION OF STUDS USED FOR HIGH-PRECISION ALIGNMENT BETWEEN MULTIPLE CHIPS

摘要

PROBLEM TO BE SOLVED: To realize high-precision alignment expected between a plurality of chips or between a substrate and chips.

SOLUTION: A combination of a plurality of studs is created for regulating relative movement of a plurality of chips in a lateral direction in the case where a solder bump is melted between the plurality of chips. For each of the plurality of chips, the combination of the plurality of studs having a predetermined width is created at a position where any solder bump is defined as a reference in the arrangement of a plurality of solder bumps disposed between the plurality of chips in accordance with a pitch of the plurality of solder bumps in such a manner that the plurality of solder bumps set to each of the plurality of chips are aligned within a predetermined range by regulating the relative movement of the plurality of chips even in the case where the plurality of chips are moved relatively to each other by melting of the plurality of solder bumps.

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