| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board which is capable of enhancing the reliability and quality of a product by reducing complication and delay during the lamination work of a thin copper foil and a prepreg, and preventing displacement or creasing of the copper foil. <P>SOLUTION: In the method of manufacturing a wiring board by using a copper foil 3 having a thickness of 18 μm or less and a prepreg 4 having a thickness of 100 μm or less, the opposing surface of the copper foil 3 is entirely stuck removably to the weak adhesive surface of a support substrate 1, the prepreg 4 and a copper foil 5 for lamination are sequentially laminated on the surface of the copper foil 3 and pressed, a laminate 6 is formed by patterning the copper foil 5 for lamination in the shape of a predetermined wiring, and after peeling the laminate 6 from the support substrate 1, the copper foil 3 forming the laminate 6 is patterned in the shape of a predetermined electrode. Since the rigidity is ensured by sticking a thin and cumbersome copper foil 3 to a rigid support substrate 1, the first copper foil 3 and the prepreg 4 can be laminated with reducing complication or delay of the work. <P>COPYRIGHT: (C)2013,JPO&INPIT |
