METHOD FOR PLATING PATTERN ELECTRODE OF LED CERAMIC PACKAGE

摘要

PURPOSE: A method for plating the pattern electrode of an LED ceramic package is provided to improve the optical property and the bonding property of the LED ceramic package by reducing the thickness difference of a plated layer. CONSTITUTION: A pattern electrode is formed on a ceramic substrate. An electroless nickel plating process is performed on the pattern electrode. An electroless gold plating process is performed on the pattern electrode. The plating bath of the electroless nickel plating process contains nickel sulfate, dimethylamine borane, sodium citrate and sulfuric acid. The plating bath of the gold plating process contains potassium gold cyanide, phosphoric acid, organic acid salt and chelating reagent.