| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable polishing processing to be automatically carried out on an optimum condition according to variations in polishing speed and polishing shape. <P>SOLUTION: A polishing method using a polishing apparatus includes the steps of: measuring a film thickness of a substrate (a wafer) before polishing (step 1); then polishing the substrate by around a half of a target polishing amount according to a polishing recipe (Rf) for a non-warped shape (step 2); then measuring a thickness of the substrate after the polishing (step 3); thereafter, according to the measurement results of the substrate before and after the polishing, correcting an error between a result of (a formula F after the polishing corresponding to the non-warped shape) and its estimation to (a formula Y after polishing corresponding to a mountain-shaped warped shape) and (a formula T after polishing corresponding to a valley-shaped warped shape), and obtaining additional polishing times for a polishing recipe (Ry) for the mountain-shaped warped shape and a polishing recipe (Rt) for the valley-shaped warped shape so that the respective measurement points of the remaining polishing amounts become minimum (step 4); and then polishing and removing the substrate for the additional polishing times according to the polishing recipe (Ry) for the mountain-shaped warped shape and the polishing recipe (Rt) for the valley-shaped warped shape (step 5). <P>COPYRIGHT: (C)2013,JPO&INPIT |
