| 摘要 |
<P>PROBLEM TO BE SOLVED: To join members of copper with good connection reliability. <P>SOLUTION: An oxide film removing solution 30 is applied to a predetermined area of a copper-based first member to be bonded 10; predetermined areas of a plurality of copper-based second members to be bonded 20 are placed on the predetermined area of the first member to be bonded 10 via the oxide film removing medicinal solution; and the first member to be bonded 10 and the plurality of the second members to be bonded 20 are heated and pressurized to bond the first member to be bonded 10 and the plurality of the second members to be bonded 20 in block by metal solid-phase diffusion. Each rear surface of the plurality of the second members to be bonded 20 on the opposite side to a bonding boundary face with the first member to be bonded 10 is made to be dent by pressurizing the plurality of the second members to be bonded 20. <P>COPYRIGHT: (C)2013,JPO&INPIT |
