| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a water-based copper paste material which facilitates formation of a conductive pattern exhibiting excellent conductivity at a low cost when forming the conductive pattern by applying and heating not an organic solvent-based conductive paste material causing the problem of VOC but a water-based copper paste material produced by dispersing copper powder to a water-based medium the main component of which is water. <P>SOLUTION: The water-based copper paste contains copper powder having an oxide film formed on the surface, a water-based reductant component capable of thermally reducing the oxide film, and a water-based binder resin in a water-based medium. The water-based copper paste material may contain one or more copper compound selected from copper oxides, copper compound complexes and copper compound salts, and may further contain an antioxidant component. The water-based reductant component may be hypophosphorous acid, ascorbic acid, hydrazine, or dimethylamine borane. <P>COPYRIGHT: (C)2013,JPO&INPIT |
