| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sheet-shaped sealing composition having flexibility stable with time, and capable of sufficiently exhibiting flux function by a carboxylic acid, and to provide a method for producing a semiconductor element by using the composition. <P>SOLUTION: The sheet-shaped sealing composition 2 comprises a thermoplastic resin having ≥100,000 of a weight-average molecular weight, an epoxy resin, a curing accelerator and a carboxy group-containing compound having ≥3.5 of pKa. The method for producing the semiconductor device 20 includes a step of dicing a semiconductor wafer 3, and obtaining a semiconductor element with the sheet-shaped sealing composition. <P>COPYRIGHT: (C)2013,JPO&INPIT |
