发明名称 RESIN COMPOSITION FOR SEALING ELECTRICAL AND ELECTRONIC PARTS, METHOD FOR PRODUCING SEALED ELECTRICAL AND ELECTRONIC PARTS, AND SEALED ELECTRICAL AND ELECTRONIC PARTS
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin composition for sealing electrical and electronic parts which is excellent in initial adhesion strength to aluminum materials, and is excellent in durability against a cold/hot cycle load and an environmental load of high temperature of 150&deg;C or more, and to provide sealed electrical and electronic parts using the same. <P>SOLUTION: The resin composition for sealing electrical and electronic parts contains a crystalline polyester resin (A) with a polycarbonate component copolymerized therein, an epoxy resin (B) and a fluororesin (C), and has a melt viscosity of 5-3,000 dPa s when the resin composition is dried to a moisture content of 0.1% or less, heated to 220&deg;C and a pressure of 1 MPa is imparted to the resin composition, and when the resin composition is extruded with a die of a hole diameter of 1.0 mm and a thickness of 10 mm. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013112771(A) 申请公布日期 2013.06.10
申请号 JP20110261786 申请日期 2011.11.30
申请人 TOYOBO CO LTD 发明人 FUNAOKA HIROKI;SHIGA KENJI
分类号 C08L67/00;C08L27/12;C08L63/00;H01L23/29;H01L23/31 主分类号 C08L67/00
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