发明名称 METHOD FOR INSTALLING ULTRASONIC PROBE AND MONITORING SYSTEM USING ULTRASONIC PROBE
摘要 <P>PROBLEM TO BE SOLVED: To continuously monitor a state of a complicated shape part of a test object without removing a thermal insulation material. <P>SOLUTION: A thin film sensor is installed on the complicated shape part of the test body by a first process (step P3) for applying a proper amount of an adhesive having thermal resistance to the complicated shape part of the test object and mounting the thin film sensor on the adhesive, a second process (step P5) for connecting an ultrasonic flaw detector to the thin film sensor to confirm a sensor signal waveform, measuring signal strength when the sensor signal waveform can be confirmed, and performing processing of the first process again when the sensor signal waveform cannot be confirmed, a third process (step S7) for releasing the connection between the thin film sensor and the ultrasonic flaw detector and curing the adhesive, and a fourth process (step S9) for connecting the ultrasonic flaw detector to the thin film sensor to confirm the sensor signal waveform, completing the installation of the thin film sensor when the strength of the sensor signal waveform is improved, and performing the processing of the first process again when the strength of the sensor signal waveform is not improved. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013113752(A) 申请公布日期 2013.06.10
申请号 JP20110261144 申请日期 2011.11.30
申请人 MITSUBISHI HEAVY IND LTD 发明人 YAMAMOTO YUKO;UEMOTO AKIHIRO;KOBAYASHI TAKAAKI
分类号 G01N29/04;G01N29/24;G21C17/003 主分类号 G01N29/04
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