PURPOSE: A vertical capacitor and a method for forming the same are provided to be manufactured in a substrate without a separate package. CONSTITUTION: An input electrode(14) and an output electrode(15) are formed in the upper surface(10a) of a substrate(10). A conductive material is formed in a first via hole formed by etching the lower surface(10b) of the substrate. The conductive material is connected to the input electrode and the output electrode. An input via electrode(24) and an output via electrode(25) are formed in the substrate. A dielectric layer(37) is formed between the input via electrode and the via electrode.
申请公布号
KR20130059673(A)
申请公布日期
2013.06.07
申请号
KR20110125763
申请日期
2011.11.29
申请人
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
发明人
KIM, SEONG IL;LEE, SANG HEUNG;LIM, JONG WON;YOON, HYUNG SUP;LEE, JONG MIN;MIN, BYOUNG GUE;MUN, JAE KYOUNG;NAM, EUN SOO