发明名称 SEALED STRUCTURE, LIGHT-EMITTING DEVICE, ELECTRONIC DEVICE, AND LIGHTING DEVICE
摘要 PURPOSE: A sealing structure, a light emitting device, an electronic device, and a lighting device are provided to prevent the leak of adhesive between two substrates in a bonding process. CONSTITUTION: A glass layer(105a) is formed on a substrate(101). A region(102a) for a sealing object is formed in a space surrounded by the substrate and the glass layer. A resin or a binder within frit paste is removed by using a prebaking process to form a glass layer(104a). A region(102b) for the sealing object is formed in a space surrounded by a pair of substrates and a resin layer(205a). A substrate is bonded to an opposed substrate by using a resin layer(205b).
申请公布号 KR20130060131(A) 申请公布日期 2013.06.07
申请号 KR20120134344 申请日期 2012.11.26
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YAMAZAKI SHUNPEI;NAKAMURA DAIKI;NISHIDO YUSUKE
分类号 H01L51/52;H05B33/04;H05B33/10 主分类号 H01L51/52
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