发明名称 |
SEALED STRUCTURE, LIGHT-EMITTING DEVICE, ELECTRONIC DEVICE, AND LIGHTING DEVICE |
摘要 |
PURPOSE: A sealing structure, a light emitting device, an electronic device, and a lighting device are provided to prevent the leak of adhesive between two substrates in a bonding process. CONSTITUTION: A glass layer(105a) is formed on a substrate(101). A region(102a) for a sealing object is formed in a space surrounded by the substrate and the glass layer. A resin or a binder within frit paste is removed by using a prebaking process to form a glass layer(104a). A region(102b) for the sealing object is formed in a space surrounded by a pair of substrates and a resin layer(205a). A substrate is bonded to an opposed substrate by using a resin layer(205b). |
申请公布号 |
KR20130060131(A) |
申请公布日期 |
2013.06.07 |
申请号 |
KR20120134344 |
申请日期 |
2012.11.26 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
YAMAZAKI SHUNPEI;NAKAMURA DAIKI;NISHIDO YUSUKE |
分类号 |
H01L51/52;H05B33/04;H05B33/10 |
主分类号 |
H01L51/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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