| 摘要 |
PURPOSE: A supporting substrate module is provided to improve bonding strength by using a connection member instead of directly bonding a load to an insertion member. CONSTITUTION: A support block(210) mounts a substrate(S). An insertion member(220) is inserted into the support block. A load(410) is inserted into the support block to be electrically connected to the insertion member. A connection member(420) is arranged between the insertion member and the load to bond the insertion member to the load. A buffer member(430) is inserted into the load to be connected to the end of the connection member.
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