| 摘要 |
A sputtering apparatus includes a substrate holder (22) which holds a substrate (21) to be rotatable in the plane direction of the processing surface of the substrate (21), a substrate-side magnet (30) which is arranged around the substrate (21) and forms a magnetic field on the processing surface of the substrate (21), a cathode (41) which is arranged diagonally above the substrate (21) and receives discharge power, a position detection unit (23) which detects the rotational position of the substrate (21), and a controller (5) which controls the discharge power in accordance with the rotational position detected by the position detection unit (23). |
