发明名称 POLISHING LIQUID FOR METAL FILM AND POLISHING METHOD
摘要 Provided are a polishing slurry for metal films and a polishing method which restrain the generation of erosion and seams, and makes the flatness of a surface polished therewith or thereby high. The slurry and the method are a polishing slurry, for metal films, comprising abrasive grains, a methacrylic acid based polymer and water, and a polishing method using the slurry, respectively.
申请公布号 KR20130060375(A) 申请公布日期 2013.06.07
申请号 KR20137013121 申请日期 2008.07.04
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 TANAKA TAKAAKI;FUKASAWA MASATO;NOBE SHIGERU;SAKURADA TAKAFUMI;SHINODA TAKASHI
分类号 C09K3/14;H01L21/304 主分类号 C09K3/14
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