| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermoelectric conversion module in which destruction of a chip due to thermal stress caused by temperature gradient in the vertical direction of the chip is prevented even if the thickness of the chip is less than 0.7 mm. <P>SOLUTION: In the thermoelectric conversion module where a large number of chips of thermoelectric conversion material are juxtaposed between a pair of substrates, and individual chips are bonded to junction electrodes provided on each substrate to constitute thermoelectric conversion elements, respectively, the thickness t6 of the substrates at at least a part provided with the junction electrodes satisfies the relation of formula (1): t6>3.5+3500×α×L-t3-t1...(1), where t6 is a total value of the thickness of the pair of substrates, α is a linear thermal expansion coefficient (1/k) of the substrates, L is a longest part dimension of the substrates (mm), t3 is a thickness of the electrode layers (mm)(total value of the electrodes on both sides of the chips), and t1 is a thickness of the chips (mm). <P>COPYRIGHT: (C)2013,JPO&INPIT |
