| 发明名称 |
Solderable Contact and Passivation for Semiconductor Dies |
| 摘要 |
A silver-containing solderable contact on a semiconductor die has its outer edge spaced from the confronting edge of an epoxy passivation layer so that, after soldering, silver ions are not present and are not therefor free to migrate under the epoxy layer to form dendrites.
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| 申请公布号 |
US2013140701(A1) |
申请公布日期 |
2013.06.06 |
| 申请号 |
US201313754822 |
申请日期 |
2013.01.30 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION;INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
STANDING MARTIN;SAWLE ANDREW;ELWIN MATTHEW P.;JONES DAVID P.;CARROLL MARTIN;WAGSTAFFE IAN GLENVILLE |
| 分类号 |
H01L21/52;H01L23/498;H01L27/095 |
主分类号 |
H01L21/52 |
| 代理机构 |
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