| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide, by unevenly distributing a solder constituent on an electrode of a substrate by means of self-structuring thereof, a reflow film which is excellent in self stability, transportability, and handleability in use, and which allows selective formation of a solder bump or solder join only on the electrode, and to provide a simple and convenient method for forming a solder bump or solder join by use of the reflow film, a solder bump having less voids and smaller variation thereby formed, and a substrate with such solder bumps. <P>SOLUTION: The reflow film comprises, in a solvent: a meltable thermoplastic resin; and solder particles. The solder particles are dispersed in the film. The method for forming a solder bump comprises: (a) the step of putting the reflow film on an electrode face of a substrate; (b) the step of further putting a plat plate thereon and then fixing them; (c) the step of heating them; and (d) the step of melting and removing the reflow film. <P>COPYRIGHT: (C)2013,JPO&INPIT |
