| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring defect inspection method, a wiring defect inspection program, and a wiring defect inspection program recording medium which allow measurement time to be reduced and allow defects to be inspected accurately and efficiently in an appropriate measurement time when detecting defects of a semiconductor substrate such as a TFT array substrate. <P>SOLUTION: In a wiring defect inspection method, a short-circuit part between plural kinds of wirings of a semiconductor substrate is detected by measuring a resistance value with voltage applied between the wirings. Detection of the short-circuit part is performed by measuring the resistance value with voltage applied between two kinds of the wirings, and measurement of the resistance value is performed by determining the order of application between the plural kinds of wirings and applying voltage between the wirings so as to shorten a measurement time. <P>COPYRIGHT: (C)2013,JPO&INPIT |
