| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the sealability and the adhesion strength while preventing an adhesive from protruding to a heat radiation surface of a metal base substrate. <P>SOLUTION: A power module according to one embodiment comprises: a metal base substrate 10; a heating electronic component 11 mounted on a mounting surface of the metal base substrate 10; a resin frame 20 having a first surface 21, a second surface 22 which is an opposite surface of the first surface 21, and an opening 23 penetrating from the first surface 21 to the second surface 22; and an adhesive 40 which is applied to a substrate housing part 24 of the resin frame 20, adheres the base substrate 10 to the resin frame 20, and fills a space between a side edge of the metal base substrate 10 and a side surface 26 of the substrate housing part 24. The resin frame 20 has the substrate housing part 24 which is recessed from the first surface 21 along the opening 23 and multiple ribs 27 protruding from the side surface 26 of the substrate housing part 24 and contacting with the side edge of the metal base substrate 10. <P>COPYRIGHT: (C)2013,JPO&INPIT |
