发明名称 STRUCTURAL BODY AND INTERCONNECT SUBSTRATE
摘要 A structural body includes a first conductor having a first opening; a second conductor, having a second opening, which is opposite to at least a portion of the first conductor; a conductor via, passing through the first opening and the second opening, which is insulated from the first conductor and the second conductor; a first interconnect, provided in the inside of the first opening, of which one end thereof is connected to the conductor via and the other end thereof is formed as an open end and which is opposite to the second conductor; and a second interconnect, provided in the inside of the second opening, of which one end thereof is connected to the conductor via and the other end thereof is formed as an open end, and which is opposite to the first conductor.
申请公布号 US2013140071(A1) 申请公布日期 2013.06.06
申请号 US201113816690 申请日期 2011.07.20
申请人 TOYAO HIROSHI;TAURA TORU 发明人 TOYAO HIROSHI;TAURA TORU
分类号 H05K1/18;H05K1/11 主分类号 H05K1/18
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