发明名称 |
Circuit connector apparatus and method therefor |
摘要 |
Aspects of the present invention are directed to circuits, circuit packages and related methods. In accordance with various example embodiments, respective electrodes are implemented to facilitate contact to a semiconductor device via different surfaces and/or sidewalls, as may be useful in connecting the device to an external package having a plurality of semiconductor devices in which same-surface connections to the devices are spatially restricted. The semiconductor device has opposing surfaces and sidewalls connecting the surfaces, and contacts to respective different regions in the device. Respective electrodes are coupled to the respective contacts and extend along/around the device to provide access to the contacts via different surfaces.
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申请公布号 |
US2013140705(A1) |
申请公布日期 |
2013.06.06 |
申请号 |
US201113309878 |
申请日期 |
2011.12.02 |
申请人 |
GROENHUIS ROELF ANCO JACOB;WALCZYK SVEN;BRUIN EMIEL;BRENNER ROLF |
发明人 |
GROENHUIS ROELF ANCO JACOB;WALCZYK SVEN;BRUIN EMIEL;BRENNER ROLF |
分类号 |
H01L23/488;H01L21/22;H01L21/60 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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