| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package which reduces the process cost and simplifies the manufacturing processes, and to provide semiconductor package module including the semiconductor package. <P>SOLUTION: A semiconductor package 100 of this invention comprises: a semiconductor chip 110 having a bonding pad 120; a re-wiring layer 140 which includes a short type re-wiring pattern 141 electrically connected with the bonding pad 120 and formed so as to make connection without causing disconnection; open type re-wiring patterns A separately formed into multiple pieces on the same layer as the short type re-wiring pattern 141; and a first substrate 150 having connection terminals for signal connection 1D, 2D which are respectively formed in the open type re-wiring patterns A. <P>COPYRIGHT: (C)2013,JPO&INPIT |
