| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an eutectic junction structure which reduces the occurrence of voids and the overflow of an eutectic body when structures are joined to each other through an eutectic reaction. <P>SOLUTION: An eutectic junction structure 300 is composed of: a junction part 101 formed on a sensor substrate 100; a gold-silicon eutectic body 301 generated through an eutectic reaction; and a junction part 201 formed on a lid substrate 200. In the junction part 101 of the sensor substrate 100, an eutectic body maldistribution structure, which unevenly distributes the eutectic body generated through the eutectic reaction, is formed in advance. The junction part 101 of the sensor substrate 100 is joined to the junction part 201 of the lid substrate 200 by the gold-silicon eutectic body 301 unevenly distributed in the junction part 101 of the sensor substrate 100. <P>COPYRIGHT: (C)2013,JPO&INPIT |
