DEFECT CORRECTION DEVICE AND DEFECT CORRECTION METHOD

摘要

This defect correction device is provided with a plurality of application needles and can carry out efficient correction operations according to defects in a substrate. A defect correction device (100) is provided with: an ink application mechanism (34) that includes a plurality of needles, for which the application diameters differ, for correcting defects; an image processing unit (21) that detects defect locations in the substrate; a calculation unit (25) that calculates defect size values that show the size of defects on the basis of images for defect locations that have been detected; a selection unit (26) that selects a needle with an application diameter that should be used for correction according to the defect size value that has been calculated; and a correction processing unit (50) that corrects the defect using a needle with an application diameter that has been selected.