| 摘要 |
A method of manufacturing a thermal head, comprising the steps of: bonding a support substrate and an upper substrate, which have a flat shape, together in a laminated state, the support substrate and the upper substrate having opposed surfaces, at least one of which includes a heat-insulating concave portion; thinning the upper substrate bonded onto the support substrate in the bonding step; measuring a thickness of the upper substrate thinned in the thinning step; forming an identifying resistor having a resistance value varied in accordance with the thickness of the upper substrate measured in the measurement step, the identifying resistor including one end grounded; and forming a heating resistor on a surface of the upper substrate thinned in the thinning step at a position opposed to the heat-insulating concave portion.
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