| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for housing an electronic component which improves the reliability of hermetic sealing to a piezoelectric vibration element, and to provide an electronic apparatus. <P>SOLUTION: A package for housing an electronic component includes: a flat plate like first insulation layer 102 having mounting parts on upper and lower surfaces; a frame like second insulation layer 103 laminated on the lower surface of the first insulation layer 102; a first connection conductor 106 formed at the mounting part 104 on the upper surface of the first insulation layer 102; a second connection conductor 107 formed at the mounting part 105 on the lower surface; and a through conductor 108 penetrating through the first insulation layer 102. An upper end part of the through conductor 108 is connected with the first connection conductor 106 and a lower end part of the through conductor 108 is electrically connected with the second connection conductor 107 through a wiring conductor 109 formed on the lower surface of the first insulation layer 102. Protruding parts 114, protruding inward, are formed on an inner periphery of the second insulation layer 103. The lower end part of the through conductor 108 is positioned between layers of the protruding parts 114 and the first insulation layer 102. <P>COPYRIGHT: (C)2013,JPO&INPIT |
