TRANSFER SUBSTRATE FOR METAL WIRING FORMATION, AND METHOD FOR METAL WIRING FORMATION WITH TRANSFER SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide: a transfer substrate for forming a piece of metal wiring on a transfer object according to a transfer technique which allows the lowering of a heating temperature on the side of the transfer object; and a method for metal wiring formation.

SOLUTION: The transfer substrate is for transferring a metal wiring material to a transfer object. The transfer substrate comprises: a base; at least one metal wiring material formed on the base; a coating layer composed of at least one layer formed on a surface of the metal wiring material; and a base metal film formed between the base and the metal wiring material. The metal wiring material is a sintered compact formed by sintering powdered metal such as gold powder with a purity of 99.9 wt.% or higher and an average particle diameter of 0.01-1.0 μm. The coating layer is made of a predetermined metal such as gold or an alloy thereof which is different from the metal wiring material in composition, and the coating layer has a total thickness of 1 μm or smaller. The base metal film is a transfer substrate made of a predetermined metal such as gold or an alloy thereof.

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