发明名称 |
MICRO WAVE PLASMA PROCESSING APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a micro wave plasma processing apparatus which can easily perform a predetermined modification treatment regardless of the geometry of a target face of an object to be processed. <P>SOLUTION: The micro wave plasma processing apparatus 1 comprises: an inner cylindrical part 30; an outer cylindrical part 31; a waveguide 33 disposed between the inner and outer cylindrical parts 30 and 31; a slit 36 which communicates to the waveguide 33, and is narrower in width than the waveguide 33 in a direction perpendicular to an axis of the cylindrical part; and a gas supply part 35 for supplying a plasma-generation gas to the slit 36. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013109875(A) |
申请公布日期 |
2013.06.06 |
申请号 |
JP20110252325 |
申请日期 |
2011.11.18 |
申请人 |
TOKAI RUBBER IND LTD;NAGOYA UNIV |
发明人 |
FUJII RIKA;SASAI TATENORI;TOYODA HIROTAKA |
分类号 |
H05H1/30;H05H1/24 |
主分类号 |
H05H1/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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