发明名称 MICRO WAVE PLASMA PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a micro wave plasma processing apparatus which can easily perform a predetermined modification treatment regardless of the geometry of a target face of an object to be processed. <P>SOLUTION: The micro wave plasma processing apparatus 1 comprises: an inner cylindrical part 30; an outer cylindrical part 31; a waveguide 33 disposed between the inner and outer cylindrical parts 30 and 31; a slit 36 which communicates to the waveguide 33, and is narrower in width than the waveguide 33 in a direction perpendicular to an axis of the cylindrical part; and a gas supply part 35 for supplying a plasma-generation gas to the slit 36. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013109875(A) 申请公布日期 2013.06.06
申请号 JP20110252325 申请日期 2011.11.18
申请人 TOKAI RUBBER IND LTD;NAGOYA UNIV 发明人 FUJII RIKA;SASAI TATENORI;TOYODA HIROTAKA
分类号 H05H1/30;H05H1/24 主分类号 H05H1/30
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