| 摘要 |
A housing of an electronic device includes a main body, at least one sidewall, and a strengthening portion. The sidewall bends outward from an edge of the main body. The sidewall includes an inner side surface adjacent to the main body and an outer side surface opposite to the inner side surface. The strengthening portion is located on the inner side surface of the at least one sidewall. The sidewall defines a connecting port at the outer side surface thereof, and the connecting port passes through the at least one sidewall and the strengthening portion. The present disclosure further provides a manufacturing method of the housing.
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