发明名称 Carbon Nanotube Contact Structures For Use With Semiconductor Dies And Other Electronic Devices
摘要 A method of making carbon nanotube contact structures on an electronic device includes growing a plurality of carbon nanotube columns on a mandrel. Electrically-conductive adhesive is applied to ends of the columns distal from the mandrel, and the columns are transferred to the electronic device. An electrically-conductive material is deposited onto some or all of the columns. The mandrel can be reused to grow a second plurality of carbon nanotube columns.
申请公布号 US2013140057(A1) 申请公布日期 2013.06.06
申请号 US201213731259 申请日期 2012.12.31
申请人 FORMFACTOR, INC.;FORMFACTOR, INC. 发明人 GRITTERS JOHN K.;MARTENS RODNEY I.;YAGLIOGLU ONNIK
分类号 H01L23/00;H01B1/20 主分类号 H01L23/00
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