发明名称 MAGNETIC HEAD HAVING A THERMAL FLY-HEIGHT CONTROL (TFC) STRUCTURE UNDER A FLAT LOWER SHIELD
摘要 In one embodiment, a method includes forming a conducting material above an insulating film, applying a mask to portions of the conducting material in a shape of a TFC structure, removing exposed portions of the conducting material to form the TFC structure, depositing an insulating film above the TFC structure, and planarizing the insulating film to form a planar upper surface of the insulating film. In another embodiment, a magnetic head includes a TFC structure positioned between insulating films and a magnetic element positioned above the TFC structure, the TFC structure configured for providing localized thermal protrusion of the magnetic head on a media facing surface thereof, wherein an upper surface of an upper of the insulating films is planar, the magnetic element includes at least one of a main magnetic pole and a read sensor, and the TFC structure is configured for providing thermal protrusion of the magnetic element.
申请公布号 US2013141813(A1) 申请公布日期 2013.06.06
申请号 US201113310428 申请日期 2011.12.02
申请人 WAGATSUMA TAKASHI;OKADA YUKIMASA;OODAKE ICHIRO;KATO ATSUSHI;HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V. 发明人 WAGATSUMA TAKASHI;OKADA YUKIMASA;OODAKE ICHIRO;KATO ATSUSHI
分类号 G11B5/02;B05D5/12;G11B5/127 主分类号 G11B5/02
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