| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a semiconductor device which enables easy positioning when semiconductor modules are assembled to a heat sink and is excellent in heat radiation performance. <P>SOLUTION: In a semiconductor device, a heat radiation surface 1a formed on the one surface side of each semiconductor module 1 is placed in contact with a heat sink 3, and a pressing plate 4 presses the semiconductor module from a surface opposite to the heat radiation surface 1a to hold the semiconductor module. Further, the pressing plate 4 is fixed to the heat sink to fix the semiconductor module 1 to the heat sink 3. The surface of the semiconductor module 1 which is opposite to the heat radiation surface 1a has protruding parts 1b for positioning, and engaged holes 4c are formed in the pressing plate 4. The protruding parts 1b engage with the engaged holes 4c to position the semiconductor module 1 in the heat sink 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
