发明名称 INTERNAL FRAME OPTIMIZED FOR STIFFNESS AND HEAT TRANSFER
摘要 A thin portable electronic device with a display is described. The components of the electronic device can be arranged in stacked layers within an external housing where each of the stacked layers is located at a different height relative to the thickness of the device. One of the stacked layers can be internal metal frame. The internal metal frame can be configured to act as a heat spreader for heat generating components located in layers adjacent to the internal frame. Further, the internal metal frame can be configured to add to the overall structural stiffness of the device. In addition, the internal metal frame can be configured to provide attachment points for device components, such as the display, so that the device components can be coupled to the external housing via the internal metal frame.
申请公布号 US2013141870(A1) 申请公布日期 2013.06.06
申请号 US201313756349 申请日期 2013.01.31
申请人 APPLE INC.;APPLE INC. 发明人 ROTHKOPF FLETCHER R.;HOBSON PHILLIP M.;MITTLEMAN ADAM;SHEDLETSKY ANNA-KATRINA
分类号 H05K7/20 主分类号 H05K7/20
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