| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress a deformation of a base plate 1 even when a screwing part 1a is fixed to a member to be mounted 200 by one screwing, then a screwing part 1b is fixed to the member to be mounted 200 by one screwing, in a state that adhering function and moisture permeation suppression function between a resin part 5 and the base plate 1 are maintained, while a grease 201 is arranged only between a mounting part 1c and the member 200 to be mounted. <P>SOLUTION: In a resin-sealed power semiconductor module 100, a base plate 1 having screwing parts 1a, 1b and a mounting part 1c between them, is provided, a power semiconductor device 2L and an outer terminal 4L are mounted on the mounting part 1c, and a part of the base plate 1 and parts of the power semiconductor device 2L and the outer terminal 4L are sealed by molding a resin material so that a lower surface 5f of the resin part 5 fits a lower surface 1D of the base plate 1. Overhang parts 1d2, 1e2, 1f2, 1g2, and straight trench parts 1h1, 1h2, 1h4, 1h5 forming an acute angle portion with respect to a central surface CPab of the base plate 1, are provided. <P>COPYRIGHT: (C)2013,JPO&INPIT |
