| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a fixed-abrasive grain wire capable of controlling a lowering of the strength of a wafer formed by cutting a workpiece, a cutting device equipped with the same, and a wafer manufactured by using either the fixed-abrasive grain wire or the cutting device. <P>SOLUTION: The fixed-abrasive grain wire 14 includes a linear wire body 22 and two or more abrasive grains 24 fixed to an outer diameter surface of the wire body 22, which is used for cutting of a workpiece. The two or more abrasive grains 24 have two peak values of distribution ratio in the distribution of a projection amount H projecting from the outer diameter of the wire body 22. To be more specific, the two or more abrasive grains include a 15[μm] or more large abrasive grain 24L and a small abrasive grain 24S whose peak value of distribution ratio is 10[μm] or less. <P>COPYRIGHT: (C)2013,JPO&INPIT |
