发明名称 Printed Circuit Board and Method Of Manufacturing The Same
摘要 Disclosed herein is a printed circuit board, including: a substrate including a first circuit layer formed on one side thereof and a second circuit layer formed on the other side thereof; and a strike-type through body externally inserted in the substrate and electrically connecting the first circuit layer and the second circuit layer. The printed circuit board is advantageous in that, since a strike-type through body is externally inserted in a substrate, conventional complicated processes, such as hole forming, deburring, desmearing, electroless copper plating and electrolytic copper plating, can be omitted, thus simplifying a process of manufacturing a printed circuit board and reducing the manufacturing cost thereof.
申请公布号 US2013139383(A1) 申请公布日期 2013.06.06
申请号 US201313752258 申请日期 2013.01.28
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD.;SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHOI KYE WON;JOUNG DA HEE;HEO CHEOL HO;CHONG MYUNG GUN;LEE SUNG JUN
分类号 H05K3/42 主分类号 H05K3/42
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