| 摘要 |
<p>Provided is a power conversion device which is capable of miniaturization and of efficiently radiating, into a cooling body, heat from a heat-generating circuit component mounted on a substrate. This power conversion device (1) is provided with a semiconductor power module (11) with one surface bonded to the cooling body (3), multiple mounting substrates (21, 22, 42) on which circuit components are mounted that include a heat-generating circuit component which drives the semiconductor power module, and heat conduction paths (35, 37) which transfer heat from the multiple mounting substrates into the cooling body (3), wherein at least the one facing pair (22, 42) of the multiple mounting substrates is laminated in a solid state with a heat conducting member (27) therebetween.</p> |
