| 摘要 |
<p>The purpose of the present invention is to provide a one-pack type epoxy resin composition which retains fast curability at 150°C or above, and exhibits high stability at an intermediate temperature range of 60-120°C. The present invention provides a one-pack type epoxy resin composition containing: (a) a liquid epoxy resin; (b) an acid anhydride curing agent or a phenolic curing agent; (c) a latent curing accelerator; and (d) 5-hydroxyisophthalic acid, 5-nitroisophthalic acid, and 1, 3, 5-benzene tricarboxylic acid or a mixture threreof.</p> |
