| 摘要 |
A memory liquid-cooling heat dissipation device, a system comprising the memory liquid-cooling heat dissipation device, and a corresponding heat dissipation method. The memory liquid-cooling heat dissipation device comprises a liquid inlet pipe, a connecting pipe, a liquid-cooling block, a liquid outlet pipe and a mainboard; the liquid inlet pipe, the liquid outlet pipe and the liquid-cooling block are fixed on the mainboard; the liquid inlet pipe and the liquid outlet pipe are respectively located at two ends of the liquid-cooling block; a memory slot is also provided on the mainboard and is close to the liquid-cooling block; the liquid-cooling block is composed of a metal block, metal domes arranged at two sides of the metal block and a liquid passageway running through the metal block; the liquid inlet pipe, the liquid passageway inside the metal block and the liquid outlet pipe are in communication through the connecting pipe, thus forming a cooling liquid loop. The memory liquid-cooling heat dissipation device realizes heat dissipation of the memory; meanwhile, as the liquid-cooling block contacts a memory bank only through the metal domes, the memory bank can be inserted and pulled out conveniently without dismantling the liquid-cooling block when the memory bank is maintained, thereby lowering the risk of cooling liquid leakage. |
