| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for effectively removing a contamination such as organopolysiloxane which originates from a die bonding paste deposited on an electrode in manufacturing a semiconductor light-emitting device. <P>SOLUTION: The method for manufacturing a semiconductor light-emitting device comprises the steps of: fixing a semiconductor light-emitting element having at least one electrode on a surface thereof to a mounting board having at least one electrode circuit on a surface thereof by means of a silicone-containing die bonding paste; curing the die bonding paste by heating the mounting board with the semiconductor light-emitting element mounted thereon; performing plasma processing for cleaning the mounting board with the semiconductor light-emitting element fixed thereon by means of plasma of a mixed gas containing argon and fluorocarbon after the curing of the die bonding paste; and connecting between the at least one electrode and the electrode circuit by wire bonding after the plasma processing. <P>COPYRIGHT: (C)2013,JPO&INPIT |
