SEMICONDUCTOR DIE CONTACT STRUCTURE AND METHOD

摘要

PROBLEM TO BE SOLVED: To provide a better buffer to a dielectric layer disposed at metalization layers of a semiconductor device.

SOLUTION: A semiconductor device comprises: a substrate comprising a plurality of dielectric layers and conductive layers; a metal contact electrically connected to one of top layers of the plurality of conductive layers and having thickness larger than about 15,000 Å; and a connector electrically connected to the metal contact.

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