发明名称 COPPER OXIDE PASTE AND METHOD FOR PRODUCING METAL COPPER LAYER
摘要 <P>PROBLEM TO BE SOLVED: To provide a copper oxide paste capable of precisely forming a metal copper layer having high definition and low resistance, and a method for producing a metal copper layer using the copper oxide paste. <P>SOLUTION: The copper oxide paste is configured to contain: a copper oxide particle group in which the average of major-axis lengths is equal to or longer than 100 nm and shorter than 1700 nm, and a ratio of the average of the major-axis lengths to the average of minor-axis lengths is 1.2 to 20 inclusive; and a dispersion medium. The copper oxide paste is applied onto a support and is subjected to a conductor forming treatment, thereby producing a metal copper layer. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013109966(A) 申请公布日期 2013.06.06
申请号 JP20110254292 申请日期 2011.11.21
申请人 HITACHI CHEMICAL CO LTD 发明人 KURODA KYOKO;YOKOTA HIROSHI;KAMISHIRO YASUSHI;NAKAKO TAKEO;NODO TAKAAKI;INADA MAKI
分类号 H01B1/20;C09D1/00;C09D5/24;C09D11/02;C09D11/033;C09D11/52;H01B1/00;H01B13/00;H05K1/09 主分类号 H01B1/20
代理机构 代理人
主权项
地址