TAPE SUBSTRATE WITH CHIP ON FILM STRUCTURE FOR LIQUID CRYSTAL DISPLAY PANEL

摘要

The present invention provides a tape substrate with chip on film (COF) structures for a liquid crystal display (LCD) panel. A plurality of package units with the COF structures are arranged along a longitudinal direction of the tape substrate. In each of the package units, input leads of the package unit are connected to a second side thereof, and the output leads extend from the second side to the package units in a bending manner. The present invention further provides the liquid crystal display panel using the tape substrate.